Emberion Advances Capability to Produce Ultra-Low-Cost SWIR Sensor Using Novel Sensor Packaging Technology
Emberion, a leading innovator in quantum dot based shortwave infrared (SWIR) sensing technology, has advanced its capability to produce ultra-low-cost SWIR sensors using novel wafer-level packaging (WLP) technology. Implementing this technology will eventually allow SWIR imaging to be introduced to high volume applications such as automotive and consumer domains. Emberion’s CTO Mark Allen will present […]
