Emberion Advances Capability to Produce Ultra-Low-Cost SWIR Sensor Using Novel Sensor Packaging Technology
Emberion, a leading innovator in quantum dot based shortwave infrared (SWIR) sensing technology, has advanced its capability to produce ultra-low-cost SWIR sensors using novel wafer-level packaging (WLP) technology. Implementing this technology will eventually allow SWIR imaging to be introduced to high volume applications such as automotive and consumer domains. Emberion’s CTO Mark Allen will present at SPIE DCS in U.S. on April 14th to share more on the most recent developments at Emberion.
Last October Emberion released plans to introduce an ultra-low-cost SWIR sensor using its unique in-house-developed wafer level packaging technology. Intensive work during the last six months has resulted in solid progress towards a commercial product as Emberion’s R&D team successfully completed the first development and testing rounds. Significant milestones include developing a low-temperature hermetic WLP process compatible with quantum dot sensors and packaging a full wafer of 100 sensors with 100% bond yield. Further steps will be taken during this year to have the WLP technology fully verified and tested by the end of 2025.
The novel packaging solution has a critical role introducing ultra low-cost SWIR sensing as it fundamentally reduces the cost per packaged sensor. The sensor fabrication cost will be roughly 50€ in large volumes, enabling a new range of applications where previous price points on market have been prohibitive. It will also enable multispectral filter integration on top of the sensor and will further improve sensor stability through robust encapsulation. As a proof point, Emberion has already reached MIL spec for sensor hermeticity during testing.
The first camera products with WLP will be brought to market during 2026 enhancing Emberion’s cost competitiveness and sensor robustness. As a result Emberion will be able to offer more competitive camera pricing for volume customers and applications where the cost of SWIR cameras has been cost prohibitive so far. Beyond 2026 Emberion will be introducing its next generation of size, weight and power optimized sensors utilizing ultra-low-cost wafer level packaging solutions. At that stage Emberion will make sensor products available for customers’ own integration to very high volume medical, automotive & even demanding consumer applications.
Link to the press release: https://www.emberion.com/solid-progress-towards-ultra-low-cost-swir-sensor-using-novel-sensor-packaging-technology/